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W25Q128JWEIM TR

W25Q128JWEIM TR

  • 厂商:

    WINBOND(华邦)

  • 封装:

    WDFN8

  • 描述:

    IC FLASH 128MBIT SPI/QUAD 8WSON

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q128JWEIM TR 数据手册
W25Q128JW 1.8V 128M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI For Industrial & Industrial Plus Grade Publication Release Date: June 29, 2020 -Revision E W25Q128JW Table of Contents 1. 2. 3. 4. 5. 6. GENERAL DESCRIPTIONS ............................................................................................................. 4 FEATURES ....................................................................................................................................... 4 PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Ball Configuration WLCSP ................................................................................................... 8 3.9 Ball Description WLCSP21 ................................................................................................... 8 PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP)............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET)(1) ................................................................................................................. 9 BLOCK DIAGRAM .......................................................................................................................... 10 FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 Standard SPI Instructions ................................................................................................... 11 6.2 Dual SPI Instructions .......................................................................................................... 11 6.3 Quad SPI Instructions......................................................................................................... 11 6.4 Software Reset & Hardware /RESET pin ........................................................................... 11 6.5 Write Protection .................................................................................................................. 12 Write Protect Features .......................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13 7.1 Status Registers ................................................................................................................. 13 Erase/Write In Progress (BUSY) – Status Only ................................................................. 13 Write Enable Latch (WEL) – Status Only ........................................................................... 13 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ................................. 13 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ........................................ 14 Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ........................................ 14 Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................ 14 Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ................................ 15 Erase/Program Suspend Status (SUS) – Status Only ....................................................... 16 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ........... 16 Quad Enable (QE) – Volatile/Non-Volatile Writable ......................................................... 16 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ...................................... 17 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable .......................... 17 -1- W25Q128JW Reserved Bits – Non Functional ...................................................................................... 17 Status Register Memory Protection (WPS = 0, CMP = 0) ................................................... 18 W25Q128JW Status Register Memory Protection (WPS = 0, CMP = 1)............................. 19 Individual Block Memory Protection (WPS=1) .................................................................... 20 8. INSTRUCTIONS ............................................................................................................................. 21 8.1 Device ID and Instruction Set Tables ................................................................................. 21 Manufacturer and Device Identification ................................................................................. 21 Instruction Set Table 1 (Standard SPI Instructions)(1) ........................................................... 22 Instruction Set Table 2 (Dual/Quad SPI Instructions)(1)......................................................... 23 8.2 Instruction Descriptions ...................................................................................................... 24 Write Enable (06h) ................................................................................................................ 24 Write Enable for Volatile Status Register (50h)..................................................................... 24 Write Disable (04h) ............................................................................................................... 25 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) ............... 25 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) ............... 26 Read Data (03h) ................................................................................................................... 28 Fast Read (0Bh) ................................................................................................................... 29 Fast Read Dual Output (3Bh) ............................................................................................... 30 Fast Read Quad Output (6Bh) .............................................................................................. 31 Fast Read Dual I/O (BBh) ................................................................................................... 32 Fast Read Quad I/O (EBh).................................................................................................. 33 Set Burst with Wrap (77h) ................................................................................................... 34 Page Program (02h) ........................................................................................................... 35 Quad Input Page Program (32h)......................................................................................... 36 Sector Erase (20h) .............................................................................................................. 37 32KB Block Erase (52h)...................................................................................................... 38 64KB Block Erase (D8h) ..................................................................................................... 39 Chip Erase (C7h / 60h) ....................................................................................................... 40 Erase / Program Suspend (75h) ......................................................................................... 41 Erase / Program Resume (7Ah) .......................................................................................... 42 Power-down (B9h) .............................................................................................................. 43 Release Power-down / Device ID (ABh) ............................................................................. 44 Read Manufacturer / Device ID (90h) ................................................................................. 45 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 46 Read Manufacturer / Device ID Quad I/O (94h) .................................................................. 47 Read Unique ID Number (4Bh) ........................................................................................... 48 Read JEDEC ID (9Fh) ........................................................................................................ 49 Read SFDP Register (5Ah)................................................................................................. 50 Erase Security Registers (44h) ........................................................................................... 51 Program Security Registers (42h) ....................................................................................... 52 Read Security Registers (48h) ............................................................................................ 53 Individual Block/Sector Lock (36h) ...................................................................................... 54 Individual Block/Sector Unlock (39h) .................................................................................. 55 Read Block/Sector Lock (3Dh)............................................................................................ 56 Global Block/Sector Lock (7Eh) .......................................................................................... 57 -2- Publication Release Date: June 29, 2020 -Revision E W25Q128JW Global Block/Sector Unlock (98h) ....................................................................................... 57 Enable Reset (66h) and Reset Device (99h) ...................................................................... 58 9. ELECTRICAL CHARACTERISTICS............................................................................................... 59 9.1 Absolute Maximum Ratings (1) .......................................................................................... 59 9.2 9.3 Operating Ranges .............................................................................................................. 59 Power-Up Power-Down Timing and Requirements ........................................................... 60 Power Cycle Requirement .................................................................................................... 61 10. 11. 12. 9.4 DC Electrical Characteristics- ............................................................................................. 62 9.5 AC Measurement Conditions ............................................................................................. 63 9.6 AC Electrical Characteristics(5) ........................................................................................... 64 9.7 Serial Output Timing ........................................................................................................... 66 9.8 Serial Input Timing.............................................................................................................. 66 9.9 /WP Timing ......................................................................................................................... 66 PACKAGE SPECIFICATIONS ....................................................................................................... 67 10.1 8-Pin SOIC 208-mil (Package Code S) .............................................................................. 67 8-Pad WSON 6x5-mm (Package Code P) ..................................................................................... 68 10.2 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 69 10.4 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 70 10.5 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 ball array) ............................................ 71 10.6 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 ball array) ............................................... 72 10.7 21-Ball WLCSP (Package Code Y, Ball pitch:0.5mm) : ..................................................... 73 ORDERING INFORMATION .......................................................................................................... 74 11.1 Valid Part Numbers and Top Side Marking ........................................................................ 75 REVISION HISTORY ...................................................................................................................... 77 -3- W25Q128JW 1. GENERAL DESCRIPTIONS The W25Q128JW (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single W25Q128JW power supply with current consumption as low as 1mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JW array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JW has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2) The W25Q128JW supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 532MHz (133MHz x 4) for Quad I/O when using the SPI Fast Read Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. 2. FEATURES  New Family of SpiFlash Memories – W25Q128JW: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset (1)  Highest Performance Serial Flash – 133MHz Quad I/O SPI clocks – 532MHz equivalent Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles – More than 20-year data retention  Low Power, Wide Temperature Range – Vcc:1.7~1.95V,-40~85℃ – -40°C to +105°C operating range(2) – 1mA active current,
W25Q128JWEIM TR
物料型号:W25Q128JW,这是Winbond公司生产的128M位SPI闪存芯片。

器件简介:W25Q128JW是一款适用于工业和工业加强级应用的1.8V 128M位串行闪存存储器,具有双通道和四通道SPI接口。它适用于需要有限空间、引脚和功率的系统中,提供灵活性和超越普通串行闪存设备的性能。

引脚分配:文档提供了不同封装类型的引脚分配图,例如SOIC 208-mil、WSON 6x5-mm / 8x6-mm、SOIC 300-mil、TFBGA 8x6-mm和WLCSP等。

参数特性:该设备在1.7V至1.95V的供电电压下工作,支持高达133MHz的SPI时钟频率,等效于532MHz的四通道SPI数据传输速率,具有最低100K次的编程/擦除周期和超过20年的数据保持能力。

功能详解:W25Q128JW支持标准SPI指令集以及双通道和四通道SPI指令集。它还具备软件和硬件重置功能,以及多种写保护特性,包括电源掉电指令的写保护和一次性编程(OTP)写保护。

应用信息:W25Q128JW适用于代码阴影到RAM、直接从双/四通道SPI执行代码以及存储声音、文本和数据。

封装信息:提供了8引脚SOIC 208-mil、8垫WSON 6x5-mm / 8x6-mm、16引脚SOIC 300-mil、24球TFBGA 8x6-mm和21球WLCSP等封装类型的详细规格。
W25Q128JWEIM TR 价格&库存

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